From: "Ann Leonard" <email@example.com>
Date: Thu, 8 Apr 2004 10:53:39 -0700
I thought you would be interested in this press release from Intel about
the company reducing lead by 95%. Examples like this help prove that it is
possible to reduce toxics use in production. Less lead used in production
means less less leaving the factory in waste or products. Obviously this
is a much better approach than trying in vain to safely regulate or
recycle the lead waste once created.
Subject: PR Advisory: INTEL WORKING TO GET THE LEAD OUT
The following release ran over Business Wire's Tech Trades circuit at
8 a.m. PT today.
CONTACT: Kevin Teixeira 408) 765-4512 firstname.lastname@example.org
INTEL WORKING TO GET THE LEAD OUT
Company Reduces Overall Use of Lead in its Logic Chips by 95 Percent
INTEL DEVELOPER FORUM, TOKYO, April 7, 2004 -- Intel Corporation today
announced it will begin eliminating approximately 95 percent of the lead
used in its processors and chipsets starting later this year. The company
is taking these significant steps to remove lead from its product
packaging in order to make it more environmentally friendly.>
Intel will begin shipping the lead-free technology with select
microprocessors and chipsets in Q3, 2004, and embedded IA processors in
Q2, 2004. The company shipped its first lead-free memory chips last year.
Additional products will be transitioned as manufacturers become
able to handle them. The new packages use lead-free solder balls, about
the size of salt crystals, and represent the majority of lead used in
Intel microprocessor packaging. Intel is working with the industry to find
a reliable solution for the tiny amount of lead still
needed inside the processor packaging to connect the actual silicon "core"
to the package.
The transition to lead-free is a massive industry-wide effort with many
technological, logistical and economic challenges. Since 2000, Intel has
been working with industry consortia and the European Union's Restriction
of Hazardous Substances (RoHS) legislation committee to come up with a
solution that can be used around the world. To achieve this, the company
developed reference procedures on its own research assembly lines to aide
customers implement lead-free technology in their manufacturing process.
"Intel shipped millions of lead-free Flash Memory components in
2003. Today's announcement is the next major step on the road to a
lead-free product line for Intel's high volume CPU and chipset product
lines," said Nasser Grayeli, Intel vice president and director of assembly
technology development, Technology and Manufacturing Group. "Our goal has
been to develop a total solution that addresses the needs and concerns of
our customers and suppliers, from the package materials to motherboard
manufacturing. By doing this, our customers will be able
to launch platforms with the new lead-free technology in the second half
Getting the Lead Out
Lead has been used in electronics for more than one hundred years because
of its electrical and mechanical properties. It has been a scientific and
technical challenge for industry researchers to develop new materials that
meet the performance and reliability requirements
for the different ways lead is used in components, products, and assembly
processes. At the same time, various national bodies around the world have
been working to reduce or eliminate lead and therefore the danger it
represents to the environment and general health.
Intel qualified its first lead-free Plastic Ball Grid Array package in
2001 for use with its Flash memory, and shipped its first lead-free
product in 2002. The lead/tin solder previously used for connecting this
package to the motherboard was replaced with a tin/silver/copper
alloy. This work allowed Intel and its customers to gain valuable insight
about what was required both technologically and logistically to make the
transition to lead-free technology.
Intel's new Flip Chip Ball Grid Array package also uses a
tin/silver/copper alloy to connect the chip package to the motherboard.
However, until Intel and the industry can certify a
replacement that meets performance and reliability requirements, a tiny of
amount of lead/tin (about .02 grams) is still used inside the sealed
package to attach the silicon core to the package.
Helping Customers Make the Transition
Intel used its assembly development lines in Arizona and Oregon,
and Malaysia facilities to perfect both flip chip packages and printed
circuit board assembly (PCA). The new lead-free compatible materials and
assembly processes were documented as reference processes for
distribution to customers and system manufacturers. This gave customers a
reference point to start redesigning their own printed circuit board
assembly processes and bring them into alignment with the lead-free
solution. Intel will continue to ship processors with
the current packaging during the transition period to aid system
manufacturers who need time to develop and qualify their lead-free
processes and products.
The Intel Developer Forum is the technology industry's premier event for
hardware and software developers. Held worldwide throughout the year, IDF
brings together key industry players to discuss cutting-edge technology
and products for PCs, servers, communications equipment,
and handheld clients. For more information on IDF and Intel technology,
Intel, the world's largest chip maker, is also a leading manufacturer of
computer, networking and communications products. Additional information
about Intel is available at
- 30 -
Intel is a trademark or registered trademark of Intel Corporation or its
subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.